Recently, the warehouse asked me to confirm with the customer whether a batch of delayed chips should be kept. If they are to be used, there may be a risk of moisture. Generally, we can just take the supplier’s advice and follow it. But since we’ve run into this issue, and with the internet resources […]
Posts in the Case study category:
How to connect PCB’s ground to the product’s metal casing?
Hey there, fellow tech enthusiasts! Today, I’m diving into a hot topic that’s been buzzing in our group chats: How do you connect your PCB‘s ground to the product’s metal casing? Let’s break it down with a twist of humor and a pinch of tech-talk. First things first, when it comes to metal casings, we’re […]
How to ensure the quality of PCBA – 14 common test methods
Printed circuit boards (PCBS) are widely used in a variety of electronic devices, whether it is mobile phones, computers, or complex machines, you can find circuit boards. If the PCB or PCBA has defects or manufacturing problems, the final product may malfunction and cause inconvenience. In these cases, manufacturers will have to recall the devices […]
Enhancing PCB Reliability and Durability: Fumax Tech’s Manufacturing Excellence
In the electronic manufacturing industry, the reliability and durability of PCBs (Printed Circuit Boards) are crucial for overall product performance and longevity. As a leading provider of PCB assembly and manufacturing services, Fumax Tech is committed to ensuring that our PCBs perform reliably across various environments. This article explores how we enhance PCB reliability and […]
Optimizing PCB Costs and Efficiency: Fumax Tech’s Expert Solutions
In today’s competitive electronics manufacturing landscape, managing costs and enhancing efficiency are pivotal for success. For manufacturers like XYZ Electronics, optimizing the procurement and production processes for printed circuit boards (PCBs) can lead to significant cost reductions and improved operational efficiency. At Fumax Tech, a leading provider of electronic manufacturing services, we offer comprehensive solutions […]
IPC Class 3 PCB Assembly Case Study: Achieving the Highest Quality Standards in Manufacturing
In the world of electronics manufacturing, IPC Class 3 represents the pinnacle of quality and reliability, suitable for aerospace, medical devices, and military applications. As a professional contract manufacturer, we adhere strictly to IPC Class 3 standards throughout our PCB Assembly process. From design and material selection to manufacturing and final testing, every step is […]
Unveiling Circuit Card Assembly 2024: From PCB Manufacturing to Board Assembly
Hey there, tech enthusiasts! Get ready to dive deep into the fascinating world of circuit card assembly. In this comprehensive guide, we’ll take you through every meticulous step of the process, from PCB manufacturing to the final assembly of the board. So grab your coffee, settle in, and let’s explore the intricate journey of bringing […]
Optimizing High-Speed Design: Balancing Signal, Power, and EMC for Success
Editor’s Note: In modern high-speed designs, analyzing signal integrity, power integrity, and EMC separately is not enough; a holistic approach is essential for successful design. Background Issue: When signals cross over segmentation areas between adjacent reference planes on a layer, discussions about signal integrity often arise. Some argue that signals should not cross the segmentation […]
PCB copper cladding
In the PCB design process, copper cladding is an important aspect, and various PCB design software provide intelligent copper cladding functionality, which covers unused spaces on the PCB with copper. The significance of copper cladding lies in reducing ground impedance, enhancing anti-interference capability, lowering voltage drop in power traces, improving power efficiency, and connecting to […]
PCB Pad Design Guideline(2)
4.3.9 When designing multilayer boards, attention should be paid to components with metal casings that are in plug-in packages and make contact with the printed circuit board. The top layer pads must not be opened. They must be covered with green oil or silkscreen ink (such as two-pin crystals, three-pin LEDs). 4.3.10 When designing and […]