Eight major processes of HDI PCB production

HDI (High Density Interconnect) production is a complex process involving multiple steps and links. The following provides you with an overview of the eight major processes of HDI PCB production. The details of each process will be gradually expanded according to your needs.

HDI production and production eight major processes:

HDI design

In the HDI production process, design is the crucial first step. This stage involves the use of professional software to create circuit diagrams and layouts to meet the needs of specific applications. Designers need deep knowledge of electronic engineering in order to correctly realize the circuit function and optimize the layout.

HDI original production

After completing the design, enter the prototype production stage. This step involves the use of laser cutting or other methods to cut the design from flexible substrates to form the basic structure of the circuit. This stage is essential to verify the correctness and integrity of the design.

Eight major processes of HDI PCB production

HDI electroplating

After the prototype is completed, electroplating is needed to increase the conductivity and improve the durability of the circuit. During the electroplating process, a layer of metal will be deposited on the surface of the circuit, such as copper or nickel to improve the electrical performance.

HDI exposure

Exposure is a very important link in HDI production. It involves light using a specific wavelength to illuminate the sensor to form a circuit pattern. This process is usually used to complete the exposure machine to ensure the accuracy and clarity of the pattern.

HDI show

After exposure, enter the show stage. In this step, the uncovered photosensitive material will be removed, and the exposure part will be retained to form a circuit pattern. This process needs to accurately control the composition and time of the developed solution to ensure the quality of the pattern.

HDI etching

After the development is completed, etching is required. The etching process uses chemical reagents to remove the non -pattern part of the material to form a accurate circuit structure. This step is essential to ensure the integrity and accuracy of the circuit.

HDI peeling

After the etching is completed, the peeling treatment is usually performed. In this step, the remaining photosensitive materials and other auxiliary materials will be removed, leaving only the final circuit structure. This process needs to accurately control the ingredients and time of the stripping solution to ensure the quality and stability of the circuit.

HDI test

The last step is testing and testing. At this stage, the HDI board needs to perform a series of tests to ensure that its performance and quality meet the requirements.

Test items may include electrical performance testing, appearance inspection, reliability testing, etc. Once the test is passed, the HDI board can be delivered to the customer.

The above is an overview of the eight major processes produced by HDI. Each process has its specific technical requirements and quality control standards, and it is necessary to strictly observe to ensure the quality and reliability of the final product.

In actual production, these processes are usually completed by professional teams, and team members must have knowledge and skills in related fields. If you need the detailed content of each process or have a deeper understanding of a specific process, please provide demand, we will continue to write for you.

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