Uncommon Errors in PCB Assembly Process and Their Underlying Causes

PCB assembly, a critical phase in electronic manufacturing, is susceptible to various uncommon errors that are often overlooked but can significantly impact the quality and functionality of electronic devices. Beyond the common defects, understanding these less frequently occurring issues and their root causes is essential for fostering a comprehensive approach to quality assurance and process […]

PCBA Inquiry Guide: How to Collaborate with Contract Manufacturers?

Introduction In today’s electronics manufacturing industry, PCBA (Printed Circuit Board Assembly) has become a vital component in many products. Whether it’s smartphones, computers, cars, or household appliances, precision circuit board assembly is indispensable. However, ensuring the quality and cost-effectiveness of PCBA requires collaboration with the right contract manufacturer. Inquiring about PCBA from manufacturers is not […]

PCB Surface treatment: A Brief Introduction

Methods for PCB pad surface treatment are used to protect the PCB pads and improve soldering performance. ENIG (Electroless Nickel Immersion Gold) and immersion gold plating are commonly used processes in today’s PCB production. With the increasing integration of ICs and the growing number of pins, vertical tin spraying processes struggle to flatten small pads, […]

What is the internal structure of PCB?

PCB (Printed Circuit Board) is an integral part of electronic products. It carries electronic components and provides electrical connections. The internal structure of PCB is composed of multi-layer circuit boards, each layer has specific functions and structures. First of all, the internal structure of PCB includes base material, conductive layer, insulating layer and pad. The […]

Detailed explanation of four-layer PCB board assembly technology

With the rapid development of electronic technology, four-layer PCB (printed circuit board) boards are widely used in various complex electronic products due to their high integration, high reliability and excellent electrical performance. Four-layer PCB board assembly technology involves multiple key steps, including design, material selection, wiring, welding, testing, etc. This article will introduce in detail […]

Analysis of the causes of PCBA SMT defects

In the production process of PCBA SMT, due to the influence of operating errors, it is easy to cause PCBA SMT defects, such as: virtual soldering, short circuit, warping, missing parts, solder beads, warped feet, floating height, wrong parts, cold welding, reverse Toward, white/reverse side, offset, component damage, less tin, too much tin, gold finger […]

Precautions for motor PCB assembly

Introduction Motor PCB (Printed Circuit Board) assembly is a key link in the motor manufacturing process. It involves multiple complex steps, including PCB design, component selection, welding, testing, etc. During this process, a series of precautions need to be strictly followed to ensure that the assembled motor PCB can operate stably and reliably. This article […]

5 main functions of PCB board insulation

PCB board insulation refers to the use of insulating materials on PCB circuit boards to isolate electrical conductors to prevent short circuits or other electrical faults. Commonly used insulation materials for PCB board insulation include FR-4 fiberglass composite, polyimide (PI), polytetrafluoroethylene (PTFE), etc. These insulating materials have high heat resistance, chemical resistance and electrical insulation […]

Introduction to ICT testing in PCB assembly

ICT testing overview ICT (In-Circuit Test) test, which is a circuit test performed during the circuit board assembly process, is a key link to ensure the quality of PCBA (Printed Circuit Board Assembly). ICT testing uses specialized test fixtures and testing software to test the electrical performance of every electronic component on the PCBA to […]

DIP packaging in SMT processing

DIP (Dual Inline Package) packaging in SMT (Surface Mount Technology) processing is a form of electronic component packaging, mainly used for packaging of integrated circuits (ICs). Basic principles and characteristics of DIP packaging Application of DIP packaging in SMT processing Advantages and limitations of DIP packaging Manufacturing process and quality control of DIP packaging Market […]