Thermoelectric separation copper substrate processing flow and technical points?

Thermoelectric separation of copper substrate refers to a thermoelectric separation process in copper substrate processing.

The circuit part of the substrate and the thermal layer part are on different circuit layers.

The thermal layer part is in direct contact with the heat dissipation part of the lamp bead to achieve the best heat dissipation and heat conduction effect. .

The thermal conductivity of the thermoelectric separation copper substrate is 398W/M.K, which overcomes the shortcomings of insufficient heat conduction and heat dissipation of existing copper substrates.

This process conducts the heat generated by electronic components directly through the heat dissipation area, greatly improving the heat dissipation effect.

Thermoelectric separation copper substrate processing flow and technical points?

The thermoelectric separation copper substrate can separate the thermal layer and the circuit layer through the following process flow, so that the heat generated by the components can be directly conducted through the heat dissipation area, and the thermal conductivity efficiency is greatly improved, thus increasing the service life of the product.

Thermoelectric separation copper substrate processing flow and technical points

  1. BOARD CUT, the purpose is to cut the substrate material into the size required for the work according to the planning requirements of the pre-production design.
  2. Baking plate: FR-4/BT materials need to be baked before production.
  3. Panel production.
  4. Exposure (EXPOSURE), the graphics on the original film are transferred to the photosensitive plate through the action of light.
  5. Develop (DEVELOPING), use developer (sodium carbonate) to decompose the unnecessary part of the wet film, and save the necessary part.
  6. Etching (ETCHING), using etching solution (alkaline copper chloride) to etch away the surface copper exposed after development to form a wiring pattern.
  7. Panel cleaning, panel cleaning and drying. After the panel is etched, fill the plastic frame with water and soak it for cleaning. After passing through the water, place it on a horizontal line and bake it in the back section (such as a plate washer, film stripping line, plate grinder, etc.) .
  8. Apply AD glue, target, and brown.
  9. Rotate the panel so that the boss matches the joint between the panel and the panel.
  10. Target shooting again, remove the film and target again, select 4 points again to add foolproofing.
  11. The grinding plate is soldered, coated with ordinary oil through the tunnel furnace, and artificially printed with miscellaneous oil (such as WG91, WT32, black sun oil, etc.).
  12. Expose solder mask and print characters.
  13. Forming and drilling. After forming and drilling, tear off the green film on the back and cut in V.
  14. Pass through the wire drawing machine, and pass the single panel V through the wire drawing machine to refine the back cloak.
  15. For anti-oxidation treatment, OSP boards are sent to peroxidation, tin-sprayed boards are sent to the board washing room, and immersion gold boards are sent to the board washing room.
  16. Pack and ship, place orders for shipment, and do not omit any reports that should be attached according to the process card.

The formation process of thermoelectric separation copper substrate includes sticking protective tape on one side of the copper base layer; forming anti-etching ink, exposure, development and etching through the circuit board process to form bumps in the heat dissipation area, and the height of the bumps is equal to the thickness of the insulation layer and circuit layer ; A layer of copper plating is electroplated on the aluminum surface through zinc immersion and copper electroplating processes; the circuit layer (copper foil) and the insulation layer (non-flowing prepreg) are stacked together.

Open a window in the heat dissipation area of the circuit layer and insulation layer. You can use die cutting or CNC molding to open the window; combine the heat dissipation layer (copper-plated aluminum substrate) with the circuit layer (copper foil) and insulation layer (non-flowing epoxy The prepregs) are pressed together by hot pressing; the circuit layer lines are produced according to the circuit board processing process to form the thermoelectric separation metal substrate provided by the present utility model.

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